Product Overview
HyperX HX426C15FBK4/32 is a kit of four 1G x 64-bit (8GB) DDR4-2666 CL15 SDRAM (Synchronous DRAM) 2Rx8, memory module, based on sixteen 512M x 8-bit FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Total kit capacity is 32GB. Each module has been tested to run at DDR4-2666 at a low latency timing of 15-17-17 at 1.2V. Additional timing parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below.
Features • Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP - 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Dual-rank • On-board I2 serial presence-detect (SPD) EEPROM • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • Height 1.340¡± (34.04mm), w/heatsink
Specifications
CL(IDD) |
15 cycles |
Row Cycle Time (tRCmin) |
45ns(min.) |
Refresh to Active/Refresh Command Time (tRFCmin) |
260ns(min.) |
Row Active Time (tRASmin) |
26.25ns(min.) |
Maximum Operating Power |
TBD W |
UL Rating |
94 V - 0 |
Operating Temperature |
0 C to +85 C |
Storage Temperature |
-55 C to +100 C | |